Multiscale Materials Characterization and Multiphysics Modeling Lab (MMCMM)

The MMCMM lab located at the Engineering Research Center focuses on sample preparation for characterization. Tools are available to mount, cut, machine, grind and polish samples. Our lab includes a glovebox with controlled atmosphere (both moisture and oxygen content) to prepare and manipulate oxygen/moisture sensitive samples including radioactive materials. We are capable of develop polishing techniques that adapt to specific needs for a wide variety of materials, including metals, ceramics, polymers and composites. We specialize in mechanical serial sectioning with controlled material removal and EBSD surface finish. The focus of this lab is characterization and modeling of deformation and fracture as well as heat and mass transport in materials, with emphasis on effects of microstructure, grain boundaries and anisotropy. The lab counts with multiprocessor computers and specialized modeling and simulation software (SolidWorksTM, HyperWorksTM, ComsolTM, AbaqusTM, AvizoFireTM, AvizoWindTM), as well as software for Digital Image Correlation (DIC) measurements (AramisTM). Experimental facilities include a fume hood, optical microscope with in-situ loading capabilities (up to 1,000 lbs) for DIC, glovebox to cut and polish mildly radioactive materials, equipment for arc melting and crystal growth of alloys as well as precision polishing.

  • Sample preparation lab.
    • Capabilities:
      • Cutting/shaping tools:
        • Electrical Discharge Machining (EDM): Can be used to obtain thin slices of conductive materials.
        • Lathe: Can be used to machine epoxy or samples into desired shapes and surface finishing.
        • Table drill: Can be used to machine and polish samples.
    • Grinding and polishing:
      • Minimet: Gentle polishing machine used mainly for samples mounted in epoxy.
      • Techprep: Precise polishing for metals, ceramics and composites. Can be used for serial sectioning.
      • Vibromet: Gentle final polishing.
    • Chemical etching, electro-polishing:
      • Fume hood: Can be used to manipulate chemicals, prepare solutions, etch samples and electro-polishing; among other functions.
    • Imaging:
      • Optical microscope: For imaging details of samples up to 60x
      • Binocular: For lower magnification imaging.
    • Glovebox:
      • Isomet: Capable of cutting samples using a diamond blade.
      • Minimet: Used to polish mounted samples.
      • Manual polishing: For delicate samples that are not mounted in epoxy.

Location: ERC368