{"id":227,"date":"2019-09-12T19:07:15","date_gmt":"2019-09-13T02:07:15","guid":{"rendered":"https:\/\/dfan.engineering.asu.edu\/?page_id=227"},"modified":"2026-06-16T16:57:00","modified_gmt":"2026-06-16T16:57:00","slug":"academic-service","status":"publish","type":"page","link":"https:\/\/faculty.engineering.asu.edu\/dfan\/academic-service\/","title":{"rendered":"Academic Service"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\"><strong><u>Conference Service<\/u><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>TPC Chair\/Co-Chair<\/strong> of International Symposium on Quality Electronic Design (ISQED), 2023\/2024\/2025\/2026<\/li>\n\n\n\n<li><strong>Founding Chair and Chair<\/strong> of \u201cIn-Memory Architectures and Computing Applications Workshop\u201d associated with Design Automation Conference (DAC), 2022\/2023\/2024\/2025\/2026<\/li>\n\n\n\n<li><strong>Technical Area Chair <\/strong>of AI2, Design Automation Conference (DAC), 2025<\/li>\n\n\n\n<li><strong>Technical Area Chair <\/strong>of \u201cMachine Learning System\u201d, Design Automation Conference (DAC), 2021<\/li>\n\n\n\n<li><strong>Technical Area Chair<\/strong> of \u201cDigital, Memory and AI Chip\u201d, International VLSI Symposium on Technology, Systems and Applications (VLSI TSA), 2024\/2025<\/li>\n\n\n\n<li><strong>Technical Area Chair <\/strong>of \u201cEmerging Computing &amp; Post-CMOS Technologies\u201d, ACM Great Lakes Symposium on VLSI (GLSVLSI) 2019\/2020\/2021\/2022\/2023<\/li>\n\n\n\n<li><strong>Technical Area Chair <\/strong>of \u201cCognitive Computing Hardware\u201d, International Symposium on Quality Electronic Design (ISQED) 2019\/2020\/2021\/2022<\/li>\n\n\n\n<li><strong>Technical Area Chair <\/strong>of \u201cArtificial Intelligence, Machine Learning, and Cognitive Computing\u201d, IEEE International Conference on Omni-layer Intelligent systems (COINS), 2025<\/li>\n\n\n\n<li><strong>Publication Chair<\/strong>, IEEE\/ACM NANOARCH 2022<\/li>\n\n\n\n<li><strong>Publicity Chair<\/strong>, IEEE Computer Society Annual Symposium on VLSI (ISVLSI) 2021<\/li>\n\n\n\n<li><strong>Financial Chair<\/strong>, IEEE Computer Society Annual Symposium on VLSI (ISVLSI) 2019<\/li>\n\n\n\n<li><strong>Local Arrangement Chair<\/strong>, IEEE CyberSciTech\/DASC\/PICom\/DataCom, Orlando, FL, 2017<\/li>\n\n\n\n<li><strong>Tutorial Session Organizer: <\/strong>\u201cToward New Era of Compute-in-Memory: From Memory Devices to Applications\u201d in Design Automation Conference, Austin (DAC) 2020.<\/li>\n\n\n\n<li><em>Panelist <\/em>of \u2018Mondays in Memory (MiM)\u2019, In-Memory Computing Webinar, May 3, 2021<\/li>\n\n\n\n<li><em>Panelist <\/em>of roundtable<em>, <\/em>2021<em> <\/em>NSF workshop on Processing-in-Memory Technology, March 17\/18, 2021<\/li>\n\n\n\n<li><em>Panelist<\/em>, ACM\/IEEE System Level Interconnect Prediction 2019 workshop, Las Vegas, NV, 2019<\/li>\n\n\n\n<li><em>Panelist<\/em> in Neuromorphic Computing and Deep Learning, ACM\/IEEE System Level Interconnect Prediction 2017 workshop, Austin, TX, 2017<\/li>\n\n\n\n<li><em>Session Chair<\/em>, Design Automation Conference, Austin (DAC), 2017\/2018\/2019<\/li>\n\n\n\n<li><em>Session Chair<\/em>, Design, Automation and Test in Europe Conference (DATE) 2020<\/li>\n\n\n\n<li><em>Session Chair<\/em>, IEEE International Conference On Computer Aided Design (ICCAD), 2018\/2019<\/li>\n\n\n\n<li><em>Session Chair<\/em>, IEEE International Conference on Computer Design (ICCD), 2017\/2018<\/li>\n\n\n\n<li><em>Session Chair<\/em>, <em>IEEE Computer Society Annual Symposium on VLSI <\/em>(ISVLSI), 2017\/ 2018\/ 2019<\/li>\n\n\n\n<li><em>Session Chair<\/em>, Asia and South Pacific Design Automation Conference (ASP DAC), 2018<\/li>\n\n\n\n<li><em>Session Chair<\/em>, Great Lakes Symposium on VLSI (GLSVLSI), 2017\/2018\/2019\/2022<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cPlatform-Specific Neural Network Acceleration\u201d,<em> <\/em>Asia and South Pacific Design Automation Conference (ASPDAC)2021<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cProcessing\/Computing-in-Memory: From Circuit to Architecture, From Digital to Analog\u201d,<em> IEEE 33rd International System-on-Chip Conference (SOCC), <\/em>2020<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cEfficient and Secure Deep Learning and Reinforcement Learning in Embedded Systems\u201d,<em> <\/em>Great Lakes Symposium on VLSI (GLSVLSI)2020<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cWhen Energy Efficiency and Multi-level Interaction Work Together\u201d,<em> <\/em>Great Lakes Symposium on VLSI (GLSVLSI)2020<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cEmerging Memory Enabled Computing: from Device to Circuits and Applications\u201d,<em> <\/em>IEEE\/ACM International Symposium on Nanoscale Architectures (NANOARCH)<em>, <\/em>2019<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cNeuromorphic Computing and Emerging Technologies\u201d, IEEE Computer Society Annual Symposium on VLSI<em>, <\/em>2019<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cEmerging Trends in Energy Efficient and Secure Neural Network Acceleration\u201d,<em> <\/em>IEEE Computer Society Annual Symposium on VLSI (ISVLSI)<em>, <\/em>2018<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cStochastic and Approximate Computing for Emerging Learning and Communication Systems\u201d,<em> <\/em>Great Lakes Symposium on VLSI (GLSVLSI)2018<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cSpin-computing: lower the barrier between memory and logic\u201d,<em> <\/em>IEEE International Conference on Computer Design (ICCD), 2017<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cInnovation in Memory Technologies and Their Applications\u201d,<em> <\/em>IEEE Computer Society Annual Symposium on VLSI (ISVLSI)<em>, <\/em>2017<\/li>\n\n\n\n<li><em>Special session organizer and contributor &#8211; <\/em>\u201cNeuromorphic Systems\u201d,<em> <\/em>IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS), 2017<\/li>\n\n\n\n<li>Best paper select committee of GLSVLSI 2017<\/li>\n\n\n\n<li>Best Paper select committee of ASP DAC 2018<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong><u>Technical Program Committee (TPC) of International Conference<\/u><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Design Automation Conference (DAC) 2018\/2019\/2020\/2021\/2025<\/li>\n\n\n\n<li>International Conference on Computer Aided Design (ICCAD) 2018\/2019\/2020<\/li>\n\n\n\n<li>Design, Automation and Test in Europe (DATE) 2020\/2024\/2025<\/li>\n\n\n\n<li>Asia and South Pacific Design Automation Conference (ASP-DAC) 2018\/2019\/2020<\/li>\n\n\n\n<li>IEEE International Symposium on High-Performance Computer Architecture (HPCA) 2020<\/li>\n\n\n\n<li>IEEE\/ACM International Symposium on Microarchitecture (Micro) 2020<\/li>\n\n\n\n<li>IEEE Winter Conference on Applications of Computer Vision (WACV), 2021<\/li>\n\n\n\n<li>ACM\/IEEE International Symposium on Low Power Electronics and Design (ISLPED) 2020\/2021\/2022\/2023<\/li>\n\n\n\n<li>International VLSI Symposium on Technology, Systems and Applications 2023<\/li>\n\n\n\n<li>Design Automation Conference (DAC) Late Breaking Results 2020<\/li>\n\n\n\n<li>Great Lakes Symposium on VLSI (GLSVLSI) 2017-2023<\/li>\n\n\n\n<li>IEEE Computer Society Annual Symposium on VLSI (ISVLSI) 2017\/2018\/2019\/2021<\/li>\n\n\n\n<li>IEEE International Symposium on Circuits and Systems (ISCAS) 2019<\/li>\n\n\n\n<li>International Conference on VLSI Design (VLSID) 2020\/2021\/2024\/2025<\/li>\n\n\n\n<li>SIGDA PhD Forum at Design Automation Conference (DAC) 2016\/2017\/2018<\/li>\n\n\n\n<li>Student Research Contest Program Committee at ICCAD 2018<\/li>\n\n\n\n<li>Student Research Forum at IEEE\/ACM ASP-DAC 2019<\/li>\n\n\n\n<li>IEEE International Symposium on Intelligent Signal Processing and Communication Systems 2017<\/li>\n\n\n\n<li>tinyML Research Symposium, 2023<\/li>\n\n\n\n<li>International Joint Conference on Neural Networks (IJCNN), 2024<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong><u>Funding Agencies Review Panel<\/u><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><em>National Science Foundation (NSF)<\/em> Review Panel, 2016\/2019\/2020\/2022\/2023\/2024<\/li>\n\n\n\n<li><em>Army Research Office<\/em> (ARO) Research Fund\/Award Review Panel, 2018<\/li>\n\n\n\n<li><em>Defense Threat Reduction Agency (DTRA)<\/em> Review Panel, 2016<\/li>\n\n\n\n<li><em>Ralph E. Powe Junior Faculty Award<\/em> of Oak Ridge Associated Universities Review Panel, 2016<\/li>\n\n\n\n<li><em>Hong Kong Research Grant Council<\/em>, 2018\/2019\/2020<\/li>\n\n\n\n<li><em>Dutch Research Council<\/em> (NWO) Award Review, 2020<\/li>\n\n\n\n<li><em>Swiss National Science Foundation <\/em>Award Review, 2021<\/li>\n\n\n\n<li><em>Fund for Scientific Research-FNRS<\/em> (F.R.S.-FNRS), Brussels, Belgium, 2022<\/li>\n\n\n\n<li><em>U.S. Army Corps of Engineer Research and Development Center (ERDC), <\/em>2022<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong><u>Academic Community Service<\/u><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>EDAA Outstanding Dissertation Award Committee<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong><u>Editors of Journals<\/u><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Guest editor of<em> Special Issue \u2013 \u2018In-Memory Computing (IMC): from technology to applications\u2019, IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, <\/em>2025<\/li>\n\n\n\n<li>Guest editor of IEEE TVLSI Special Section on ISLPED 2025<\/li>\n\n\n\n<li>Guest editor of<em> Special Issue \u2013 \u2018Emerging In-Memory Computing Architectures and Applications\u2019, IEEE Transactions on Emerging Topics in Computing (TETC) <\/em>2023, 2024<\/li>\n\n\n\n<li>Guest editor of<em> Special Issue \u2013 \u2018Solid-State Devices and Their Applications in Neuromorphic Computing\u2019, MDPI Micromachine<\/em><\/li>\n\n\n\n<li>Guest editor of<em> Special Issue \u2013 \u2018Physical phenomena for Future Electronics\u2019, Frontiers in Physics<\/em><\/li>\n\n\n\n<li>Guest editor of<em> Special Issue \u2013 \u2018Hardware-Aware Deep Learning\u2019, Applied Sciences<\/em><\/li>\n\n\n\n<li>Guest editor of <em>Special Issue &#8211; \u2018Disruptive Computing Technologies\u2019, CCF Transactions on High Performance Computing<\/em><\/li>\n\n\n\n<li>Topic Editor of <em>Micromachines (ISSN 2072-666X)<\/em><\/li>\n\n\n\n<li>Review Editor in<em> Frontiers in Neuroscience-Neuromorphic Engineering<\/em><\/li>\n\n\n\n<li>Review Editor in<em> Frontiers in Electronics<\/em><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong><u>Journal Technical Reviewer<\/u><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Reviewer of <em>Nature Electronics<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Neural Networks and Learning Systems (TNNLS)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Very Large Scale Integrated Systems (TVLSI)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Nanotechnology<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Computers<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Emerging Topics in Computing (TETC)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Embedded Computing Systems (TECS)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Emerging Topics in Computational Intelligence (TETCI)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Electronic Device (TED)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Circuits and Systems I (TCAS-I)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Circuits and Systems II (TCAS-II)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Multi-Scale Computing Systems (TMSCS)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Circuits and Systems for Video Technology (TCSVT)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Aerospace &amp; Electronic Systems<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Medical Imaging<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Green Communications and Networking<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Transactions on Parallel and Distributed Systems (TPDS)<\/em><\/li>\n\n\n\n<li>Reviewer of<em> IEEE Electron Device Letters (EDL)<\/em><\/li>\n\n\n\n<li>Reviewer of<em> IEEE Magnetics Letters<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Journal on of Solid-State Circuits (JSSC)<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Journal on Emerging and Selected Topics in Circuits and Systems<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Design &amp; Test<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IEEE Journal of Exploratory Solid-State Computational Devices and Circuits<\/em><\/li>\n\n\n\n<li>Reviewer of<em> IEEE Embedded Systems Letters<\/em><\/li>\n\n\n\n<li>Reviewer of<em> IEEE Computer Architecture Letter<\/em><\/li>\n\n\n\n<li>Reviewer of<em> IEEE Access<\/em><\/li>\n\n\n\n<li>Reviewer of<em> IEEE Circuit and Systems Magazine<\/em><\/li>\n\n\n\n<li>Reviewer of <em>ACM Journal on Emerging Technologies in Computing Systems<\/em><\/li>\n\n\n\n<li>Reviewer of <em>ACM Transactions on Modeling and Performance Evaluation of Computing Systems<\/em><\/li>\n\n\n\n<li>Reviewer of <em>ACM Transactions on Design Automation of Electronic Systems<\/em><\/li>\n\n\n\n<li>Reviewer of <em>IET Cyber-Physical Systems: Theory &amp; Applications<\/em><\/li>\n\n\n\n<li>Reviewerof<em> Journal of Applied Physics<\/em><\/li>\n\n\n\n<li>Reviewers of <em>Royal Society of Chemistry, Nanoscale<\/em><\/li>\n\n\n\n<li>Reviewers of <em>Applied Sciences<\/em><\/li>\n\n\n\n<li>Reviewers of <em>Applied Physics Letter<\/em><\/li>\n\n\n\n<li>Reviewer of <em>ELSEVIER Nano Communication Networks<\/em><\/li>\n\n\n\n<li>Reviewer of <em>ELSEVIER Neurocomputing<\/em><\/li>\n\n\n\n<li>Reviewer of <em>ELSEVIER Engineering Science and Technology<\/em><\/li>\n\n\n\n<li>Reviewer of <em>ELSEVIER Integration, The VLSI Journal<\/em><\/li>\n\n\n\n<li>Reviewer of <em>ELSEVIER Physics Letters A<\/em><\/li>\n\n\n\n<li>Reviewer of <em>Journal of Computational Electronics<\/em><\/li>\n\n\n\n<li>Reviewer of <em>Journal of Systems Architecture<\/em><\/li>\n\n\n\n<li>Reviewer of <em>Electronics<\/em> <em>(ISSN 2079-9292)<\/em><\/li>\n\n\n\n<li>Reviewer of AEU-<em>International Journal of Electronics and Communications<\/em><\/li>\n\n\n\n<li>Reviewer of <em>Sensors <\/em>(ISSN 1424-8220)<\/li>\n\n\n\n<li>Reviewer of MDPI <em>Molecules<\/em><\/li>\n\n\n\n<li>Reviewer of <em>SCIENCE CHINA Information Sciences<\/em><\/li>\n\n\n\n<li>Reviewer of <em>Frontiers Neuroscience<\/em><\/li>\n\n\n\n<li>Reviewer of <em>Frontiers in Nanotechnology<\/em><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong><u>Conference Technical Reviewer<\/u><\/strong><strong><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Reviewer of <em>International Conference on Machine Learning <\/em>(ICML) 2021<\/li>\n\n\n\n<li>Reviewer of <em>International Conference on Computer Vision <\/em>(ICCV) 2021<\/li>\n\n\n\n<li>Reviewer of <em>34th Conference on Neural Information Processing Systems<\/em> (NeurIPS) 2020\/2021<\/li>\n\n\n\n<li>Reviewer of 53<sup>rd<\/sup> <em>IEEE\/ACM International Symposium on Microarchitecture<\/em> (MICRO), 2020<\/li>\n\n\n\n<li>Reviewer of <em>Design Automation Conference<\/em> (DAC) 2018\/2019<\/li>\n\n\n\n<li>Reviewer of <em>Asia Conference on Computer Vision<\/em> (ACCV) 2020<\/li>\n\n\n\n<li>Reviewer of <em>Asia and South Pacific Design Automation Conference<\/em> (ASP-DAC) 2018\/2019\/2020<\/li>\n\n\n\n<li>Reviewer of <em>Great Lakes Symposium on VLSI<\/em> (GLSVLSI) 2017, 2018<\/li>\n\n\n\n<li>Reviewer of <em>IEEE Computer Society Annual Symposium on VLSI <\/em>(ISVLSI) 2017,2018<\/li>\n\n\n\n<li>Reviewer of SIGDA PhD Forum at Design Automation Conference (DAC) 2016, 2017<\/li>\n\n\n\n<li>Reviewer of <em>IEEE International Symposium on Intelligent Signal Processing and Communication Systems <\/em>(ISPACS) 2017<\/li>\n\n\n\n<li>Reviewer of <em>International Symposium on Quality Electronic Design<\/em> (ISQED), 2017<\/li>\n\n\n\n<li>Reviewer of <em>International Symposium on Circuits &amp; Systems<\/em> (ISCAS), 2017\/2019<\/li>\n\n\n\n<li>Reviewer of IEEE <em>International Conference on Nanotechnology<\/em>, 2017<\/li>\n\n\n\n<li>Reviewer of <em>International Symposium on Low Power Electronics and Design<\/em> (ISLPED), 2015<\/li>\n\n\n\n<li>Reviewer of <em>International Midwest Symposium on Circuits and Systems<\/em> (MWSCAS), 2012<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong><u>Professional Community Membership<\/u><\/strong><strong><\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Senior Member of <em>Institute of Electrical and Electronics Engineers<\/em> (<em>IEEE)<\/em><\/li>\n\n\n\n<li>Senior Member of <em>IEEE Council on Electronic Design Automation (CEDA)<\/em><\/li>\n\n\n\n<li>Senior Member<em> of IEEE Circuits and Systems Society<\/em><\/li>\n\n\n\n<li>Senior Member of <em>Association for Computing Machinery<\/em> (<em>ACM)<\/em><\/li>\n\n\n\n<li>Senior Member of <em>ACM Special Interest Group in Design Automation (SIGDA)<\/em><\/li>\n\n\n\n<li>Member of <em>American Association for the Advancement of Science (AAAS)<\/em><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p class=\"mb-2\">Conference Service Technical Program Committee (TPC) of International Conference Funding Agencies Review Panel Academic Community Service Editors of Journals Journal Technical Reviewer Conference Technical Reviewer Professional Community Membership<\/p>\n","protected":false},"author":381,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-227","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Academic Service - Deliang Fan<\/title>\n<meta name=\"robots\" content=\"index, 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