Materials at the micrometer and submicrometer scale exhibit mechanical properties that are substantially different from bulk materials. With the increasing miniaturization of devices, an accurate characterization of micro/nanoscale materials is necessary to ensure their reliability and performance. Precise characterization is also essential for a fundamental understanding of mechanisms that govern size dependent material responses. In situ testing is especially attractive for micro/nanoscale samples because one can monitor the overall macroscopic response while simultaneously observing the underlying deformation mechanisms and thus establish the structure-property relationship. To overcome these key obstacles, we develop and utilize MEMS-based methods for in situ materials characterization.

Selected papers

  • W. Kang*, M. Merrill, and J. Wheeler, In Situ Thermomechanical Testing Methods for Micro/Nano-Scale Materials, 9 (8), 2666-2688, Nanoscale, 2017, (Featured as the cover article, IF: 7.9).
  • ​​R. Reid+, A. Pique, and W. Kang*, A Novel Method for In Situ Electro-Mechanical Characterization of Nanoscale Specimens, DOI: 10.3791/55735, JoVE, 2017.
  • ​​W. Kang*, I. Beniam, and S. Qidwai, In situ electron microscopy studies of electro-mechanical behavior in nanoscale metals using a novel microdevice-based method, 87, 095001, Review of Scientific Instruments, 2016 (Link).
  • W. Kang and T. Saif, Size and Temperature Effect on Brittle-to-Ductile Transition in Single Crystal Silicon, 23(6), 713-719, Advanced Functional Materials, 2013 (IF: 11.8).
  • W. Kang and T. Saif, A SiC MEMS Apparatus for In Situ Uniaxial Testing of Micro/Nanomaterials at High Temperature, 21(10), 105017, Journal of Micromechanics and Microengineering, 2011, (IOP Select Paper).