{"id":111,"date":"2022-09-05T19:53:01","date_gmt":"2022-09-06T02:53:01","guid":{"rendered":"https:\/\/faculty.engineering.asu.edu\/vidyachhabria\/?page_id=111"},"modified":"2025-08-04T11:41:48","modified_gmt":"2025-08-04T18:41:48","slug":"publications","status":"publish","type":"page","link":"https:\/\/faculty.engineering.asu.edu\/vidyachhabria\/publications\/","title":{"rendered":"Publications"},"content":{"rendered":"\n<h3 class=\"wp-block-heading\">Book chapters<\/h3>\n\n\n\n<ol class=\"wp-block-list\">\n<li>V. A. Chhabria and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/link.springer.com\/chapter\/10.1007\/978-3-031-13074-8_5\">Deep Learning for Analyzing Power Delivery Networks and Thermal Networks<\/a>,&#8221; in Machine Learning Applications in Electronic Design Automation, J. Hu and H. Ren, eds., Springer, New York, NY, 2023.<\/li>\n<\/ol>\n\n\n\n<h3 class=\"wp-block-heading\">Journals<\/h3>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>[TODAES&#8217;25]<\/strong> M. A. A. Shohel, V. A. Chhabria, N. Evmorfopoulos, and S. S. Sapatnekar,  &#8220;<a href=\"https:\/\/dl.acm.org\/doi\/10.1145\/3734796\">An Analytical Solution for Transient Electromigration Stress in Multisegment Straight-line Interconnects Based on a Stress-wave Model<\/a>,&#8221; in the ACM Transactions on Design Automation of Electronic Systems (TODAES), 2025.<\/li>\n\n\n\n<li><strong>[TCAD&#8217;25] <\/strong>Z. Wang, P. S. Nalla, J. Sun,  A. A. Goksoy,  S. K. Mandal, J.-S. Seo, V. A. Chhabria, J.Zhang, C. Chakrabarti, U. Y. Ogras, and Y. Cao, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/abstract\/document\/10844846\">HISIM: Analytical Performance Modeling and Design Space Exploration of 2.5D\/3D Integration for AI Computing<\/a>,&#8221; in&nbsp;the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2025. <\/li>\n\n\n\n<li><strong>[TODAES&#8217;23]<\/strong> V. A. Chhabria, W. Jiang, A. B. Kahng, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/dl.acm.org\/doi\/10.1145\/3626959\" data-type=\"link\" data-id=\"https:\/\/dl.acm.org\/doi\/10.1145\/3626959\">A Machine Learning Approach to Improving Timing Consistency between Global Route and Detailed Route,<\/a>&#8221;  in the ACM Transactions on Design Automation of Electronic Systems (TODAES), 2023.<\/li>\n\n\n\n<li><strong>[TODAES&#8217;22]<\/strong> V. A. Chhabria, V. Ahuja, A. Prabhu, N. Patil, P. Jain, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/dl.acm.org\/doi\/10.1145\/3526115\">Encoder-Decoder Networks for Analyzing Thermal and Power Delivery Networks,<\/a>&#8221; in the ACM Transactions on Design Automation of Electronic Systems (TODAES), 2022.<\/li>\n\n\n\n<li><strong>[TCAD&#8217;21]<\/strong> V. A. Chhabria and S. S. Sapatnekar,&nbsp;<a href=\"https:\/\/arxiv.org\/abs\/2110.14184\">&#8220;<\/a><a href=\"https:\/\/ieeexplore.ieee.org\/document\/9634106\">OpeNPDN: A Neural-network-based Framework for Power Delivery Network Synthesis,<\/a><a href=\"https:\/\/arxiv.org\/abs\/2110.14184\">&#8220;<\/a> in the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2021.<\/li>\n<\/ol>\n\n\n\n<h3 class=\"wp-block-heading\">Conferences<\/h3>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>[GLSVLSI&#8217;25]<\/strong> J. Hu, C. C. Sudarshan, M. Clifford, V. A. Chhabria, and A. Arora, &#8220;<a href=\"https:\/\/dl.acm.org\/doi\/full\/10.1145\/3716368.3735235\">CarbonSet: A Dataset to Analyze Trends and Benchmark the Sustainability of CPUs and GPUs<\/a>,&#8221;  Proceedings of the Great Lakes Symposium on VLSI (GLSVLSI), 2025.<\/li>\n\n\n\n<li><strong>[ICLAD&#8217;25] <\/strong>B.-Y. Wu, U. Sharma, A. Rovinski, and V. A. Chhabria, &#8220;OpenROAD Agent: An Intelligent Self-Correcting Script Generator for OpenROAD,&#8221; Proceedings of IEEE International Conference on LLM-Aided Design (ICLAD), 2025. <\/li>\n\n\n\n<li><strong>[ISPD&#8217;25]<\/strong>  V. A. Chhabria, J. Hu, A. B. Kahng, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/dl.acm.org\/doi\/10.1145\/3698364.3709131\">Invited: Toward an ML EDA Commons: Establishing Standards, Accessibility, and Reproducibility in ML-driven EDA Research<\/a>,&#8221; Proceedings of International Symposium on Physical Design (ISPD), 2025.<\/li>\n\n\n\n<li>[<strong>IGSC&#8217;24<\/strong>] C. C. Sudarshan, Aman Arora, and V. A. Chhabria, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/abstract\/document\/10765600\">Beyond the Surface: The Necessity for Detailed Metrics in Corporate Sustainability Reports<\/a>,\u201d Proceedings of International Green and Sustainable Computing Conference (IGSC), 2024.<\/li>\n\n\n\n<li>[<strong>ICCAD&#8217;24<\/strong>] N. Karmokar, S.-W. Tam, T. V. Dinh, V. A. Chhabria, R. Harjani, and S. S. Sapatnekar, \u201c<a href=\"https:\/\/dl.acm.org\/doi\/abs\/10.1145\/3676536.3676829\">Analyzing the Impact of FinFET Self-Heating on the Performance of RF Power Amplifiers<\/a>,\u201d Proceedings of IEEE\/ACM International Conference on Computer-Aided Design (ICCAD), 2024<\/li>\n\n\n\n<li>[<strong>ICCAD&#8217;24<\/strong>] V. A. Chhabria, B.-Y. Wu, U. Sharma, K Kunal, A. Rovinsk, and S. S. Sapatnekar, \u201c<a href=\"http:\/\/Vidya A. Chhabria, Bing-Yue Wu, Utsav Sharma, Kishor Kunal, Austin Rovinski, and Sachin S. Sapatnekar. 2025. Generative Methods in EDA: Innovations in Dataset Generation and EDA Tool Assistants. In Proceedings of the 43rd IEEE\/ACM International Conference on Computer-Aided Design (ICCAD '24). Association for Computing Machinery, New York, NY, USA, Article 57, 1\u20137. https:\/\/doi.org\/10.1145\/3676536.3697122\">Generative Methods in EDA: Innovations in Dataset Generation and EDA Tool Assistants<\/a>,\u201d Proceedings of IEEE\/ACM International Conference on Computer-Aided Design (ICCAD), 2024. (Invited paper)<\/li>\n\n\n\n<li>[<strong>ICCAD&#8217;24<\/strong>] V. A. Chhabria, V. Gopalakrishnan, A. B. Kahng, S. Kundu, Z. Wang, B.-Y. Wu, D. Yoon, \u201c<a href=\"https:\/\/dl.acm.org\/doi\/abs\/10.1145\/3676536.3697136\">Strengthening the Foundations of IC Physical Design and ML EDA Research<\/a>,\u201d Proceedings of IEEE\/ACM International Conference on Computer-Aided Design (ICCAD), 2024. (Invited paper)<\/li>\n\n\n\n<li>[<strong>ICCAD&#8217;24<\/strong>] B.-Y. Wu, R. Liang, G. Pradipta, A. Agnesina, H. Ren, V. A. Chhabria, <a href=\"https:\/\/dl.acm.org\/doi\/abs\/10.1145\/3676536.3689912\">\u201c2024 ICCAD CAD Contest Problem C: Scalable Logic Gate Sizing using ML Techniques and GPU Acceleration,<\/a>\u201d Proceedings of IEEE\/ACM International Conference on Computer-Aided Design (ICCAD), 2024. (Invited paper)<\/li>\n\n\n\n<li><strong>[MLCAD&#8217;24]<\/strong> W. Jiang, V. A. Chhabria, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/doi.org\/10.1109\/MLCAD62225.2024.10740227\">IR-Aware ECO Timing Optimization Using Reinforcement Learning<\/a>,&#8221; ACM\/IEEE International Symposium on Machine Learning for CAD (MLCAD), 2024. (Best paper nominated).<\/li>\n\n\n\n<li><strong>[MLCAD&#8217;24]<\/strong> U. Sharma, B.-Y. Wu, S. R. D. Kankipati, V. A. Chhabria, and A. Rovinski, \u201c<a href=\"https:\/\/doi.org\/10.1109\/MLCAD62225.2024.10740242\">OpenROAD-Assistant: An Open-Source Large Language Model for Physical Design Tasks<\/a>,\u201d ACM\/IEEE International Symposium on Machine Learning for CAD (MLCAD), 2024.<\/li>\n\n\n\n<li><strong>[ISLPED&#8217;24]<\/strong> V. Gopalakrishnan, B.-Y. Wu, and V. A. Chhabria, \u201c<a href=\"https:\/\/dl.acm.org\/doi\/abs\/10.1145\/3665314.3670807\">ML-INSIGHT: Machine Learning for Inrush Current Prediction and Power Switch Network Improvement,<\/a>\u201d Proceedings of ACM\/IEEE International Symposium on Low Power Electronics and Design (ISPLED)<em>, <\/em>2024.<\/li>\n\n\n\n<li><strong>[LAD&#8217;24]<\/strong> B.-Y. Wu, U. Sharma, S. R. D. Kankipati, A. Yadav, B. K. George, S. R. Guntupalli, A. Rovinski, and V. A. Chhabria, \u201c<a href=\"https:\/\/ieeexplore.ieee.org\/document\/10691774\">EDA-Corpus: A Large Language Model Dataset for Enhanced Interaction with OpenROAD<\/a>,\u201d Proceeding of<em> <\/em>IEEE International Workshop on LLM-Aided Design (LAD), 2024. (Best paper nominated)<strong>.<\/strong><\/li>\n\n\n\n<li><strong>[VTS&#8217;24]<\/strong> V. A. Chhabria, W. Jiang, A. B. Kahng, R. Liang, H. Ren, S. S. Sapatnekar, and B.-Y. Wu, \u201c<a href=\"https:\/\/ieeexplore.ieee.org\/document\/10538770\" data-type=\"link\" data-id=\"https:\/\/ieeexplore.ieee.org\/document\/10538770\">OpenROAD and CircuitOps: Infrastructure for ML EDA Research and Education,<\/a>\u201d <em>Proceedings of the IEEE VLSI Test Symposium (VTS)<\/em>, 2024.<\/li>\n\n\n\n<li><strong>[DAC&#8217;24]<\/strong> C. C. Sudarshan,&nbsp;Aman Arora, and &nbsp;V. A. Chhabria, &#8220;<a href=\"https:\/\/dl.acm.org\/doi\/10.1145\/3649329.3657343\">GreenFPGA: Evaluating FPGAs as Environmentally Sustainable Computing Solutions<\/a>, &#8220;Proceedings of ACM\/IEEE Design Automation Conference (DAC), 2024.<\/li>\n\n\n\n<li><strong>[HPCA&#8217;24]<\/strong> C. C. Sudarshan, N. Matkar, S. Vrudhula, S. S. Sapatnekar, and V. A. Chhabria &#8220;<a href=\"https:\/\/arxiv.org\/abs\/2306.09434\" data-type=\"link\" data-id=\"https:\/\/arxiv.org\/abs\/2306.09434\">ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSI,<\/a>&#8221; Proceedings of the IEEE International Symposium on High-Performance Computer Architecture, 2024.<\/li>\n\n\n\n<li><strong>[ASP-DAC&#8217;24]<\/strong> Z. Wang, J. Sun, A. Goksoy, S. K. Mandal, Y. Liu, JS Seo, C. Chakrabarti, U. Y. Ogras, V. A. Chhabria, J. Zhang, and Y. Cao &#8220;<a href=\"https:\/\/doi.org\/10.1109\/ASP-DAC58780.2024.10473875\">Exploiting 2.5 D\/3D Heterogeneous Integration for AI Computing<\/a>,&#8221; Proceedings of the IEEE Asia and South Pacific Design Automation Conference (ASP-DAC), 2024.<\/li>\n\n\n\n<li><strong>[ASICON&#8217;23]<\/strong> Z. Wang, J. Sun, A. Goksoy, S.K. Mandal, JS Seo, C. Chakrabarti, U. Y. Ogras, V. A. Chhabria, and Y. Cao. &#8220;<a href=\"https:\/\/doi.org\/10.1109\/ASICON58565.2023.10396377\">Benchmarking Heterogeneous Integration with 2.5 D\/3D Interconnect Modeling<\/a>, &#8221; Proceedings of the<em> <\/em>International Conference on ASIC (ASICON), 2023.<\/li>\n\n\n\n<li><strong>[ISPD&#8217;23]<\/strong> N. Evmorfopoulos, M. A. A. Shohel, Olympia Axelou, Pavlos Stoikos, V. A. Chhabria, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/dl.acm.org\/doi\/abs\/10.1145\/3569052.3578919\" data-type=\"link\" data-id=\"https:\/\/dl.acm.org\/doi\/abs\/10.1145\/3569052.3578919\">Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects,<\/a>&#8221; Proceedings of the International Symposium on Physical Design (ISPD), 2023.<\/li>\n\n\n\n<li><strong>[ICCAD&#8217;23]<\/strong> G. S. P. Kadagala, and V. A. Chhabria, &#8220;<a href=\"https:\/\/iccad-contest.org\/Problems.html\">ICCAD CAD Contest Problem C: Static IR Drop Estimation Using Machine Learning,<\/a>&#8221; Proceedings of IEEE\/ACM International Conference on Computer-Aided Design (ICCAD), 2023.<\/li>\n\n\n\n<li><strong>[ICCAD&#8217;23]<\/strong> M. A. A. Shohel, V. A. Chhabria, Nestor Evmorfopoulos, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/abstract\/document\/10323810\" data-type=\"link\" data-id=\"https:\/\/ieeexplore.ieee.org\/abstract\/document\/10323810\">Frequency-Domain Transient Electromigration Analysis Using Circuit Theory<\/a>,&#8221; Proceedings of IEEE\/ACM International Conference on Computer-Aided Design (ICCAD), 2023.<\/li>\n\n\n\n<li><strong>[ICCAD&#8217;23]<\/strong> Rongjian Liang, Anthony Agnesina, G. Pradipta, V. A. Chhabria, and H. Ren, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/abstract\/document\/10323611\" data-type=\"link\" data-id=\"https:\/\/ieeexplore.ieee.org\/abstract\/document\/10323611\">CircuitOps: An ML Infrastructure Enabling Generative AI for VLSI Circuit Optimization,<\/a>&#8221; Proceedings of IEEE\/ACM International Conference on Computer-Aided Design (ICCAD), 2023.<\/li>\n\n\n\n<li><strong>[ISQED&#8217;23]<\/strong> V. A. Chhabria and S. Sapatnekar, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/abstract\/document\/10129399\" data-type=\"link\" data-id=\"https:\/\/ieeexplore.ieee.org\/abstract\/document\/10129399\">Analysis of Pattern-dependent Rapid Thermal Annealing Effects on SRAM Design,<\/a>&#8221; Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), 2023.<\/li>\n\n\n\n<li><strong>[MLCAD&#8217;22]<\/strong> V. A. Chhabria, W. Jiang, A. B. Kahng, and S. Sapatnekar, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/document\/9900099\" data-type=\"link\" data-id=\"https:\/\/ieeexplore.ieee.org\/document\/9900099\">From Global Route to Detailed Route: ML for Fast and Accurate Wire Parasitics and Timing Prediction<\/a>,&#8221; Proceedings of ACM\/IEEE Workshop on Machine Learning for CAD (MLCAD), 2022.<\/li>\n\n\n\n<li><strong>[MLCAD&#8217;22] <\/strong>V. A. Chhabria, B. Keller, Y. Zhang, S. Vollola, S. Pratty, H. Ren, and B. Khailany, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/document\/9900084\" data-type=\"link\" data-id=\"https:\/\/ieeexplore.ieee.org\/document\/9900084\">XT-PRAGGMA: Crosstalk Pessimism Reduction Achieved with GPU Gate-level Simulations and Machine Learning<\/a>,&#8221; Proceedings of ACM\/IEEE Workshop on Machine Learning for CAD (MLCAD), 2022.<\/li>\n\n\n\n<li><strong>[ICCAD&#8217;21]<\/strong> V. A. Chhabria, K.Kunal, M. Zabihi, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/document\/9643566\">BeGAN: Power Grid Benchmark Generation Using a Process-portable GAN-based Methodology<\/a>,&#8221; Proceedings of IEEE\/ACM International Conference On Computer Aided Design (ICCAD), 2021.<\/li>\n\n\n\n<li><strong>[ICCAD&#8217;21]<\/strong> M. A. A. Shohel, V. A. Chhabria, Nestor Evmorfopoulos, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/document\/9643570\">Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections<\/a>,&#8221; Proceedings of IEEE\/ACM International Conference On Computer Aided Design (ICCAD), 2021 (Best Paper Award).<\/li>\n\n\n\n<li><strong>[DAC&#8217;21]<\/strong> M. A. A. Shohel, V. A. Chhabria, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/document\/9586127\">A New, Computationally Efficient &#8220;Blech Criterion&#8221; for Immortality in General Interconnects<\/a>,&#8221; Proceedings of ACM\/IEEE Design Automation Conference (DAC), 2021.<\/li>\n\n\n\n<li><strong>[DATE&#8217;21]<\/strong> V. A. Chhabria, Y. Zhang, H. Ren, B. Keller, B. Khailany, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/abstract\/document\/9473914\">MAVIREC: ML-Aided Vectored IR-Drop Estimation and Classification,<\/a>&#8221; Proceedings of Design, Automation, and Test in Europe (DATE), 2021.<\/li>\n\n\n\n<li><strong>[ASP-DAC&#8217;21]<\/strong>  V. A. Chhabria, V. Ahuja, A. Prabhu, N. Patil, P. Jain, and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/document\/9371634\">Thermal and IR Drop Analysis Using Convolutional Encoder-Decoder Networks,<\/a>&#8221; Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC), 2021.<\/li>\n\n\n\n<li><strong>[ASP-DAC&#8217;20]<\/strong> V. A. Chhabria, A. B Kahng, M. Kim, U. Mallappa, S. S. Sapatnekar, and B. Xu, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/document\/9045303\">Template-based PDN Synthesis in Floorplan and Placement Using Classifier and CNN Techniques,<\/a>&#8221; Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC), 2020.<\/li>\n\n\n\n<li><strong>[ISQED&#8217;19]<\/strong>  V. A. Chhabria and S. S. Sapatnekar, &#8220;<a href=\"https:\/\/ieeexplore.ieee.org\/abstract\/document\/8697786\">Impact of Self-heating on Performance and Reliability in FinFET and GAAFET Designs,<\/a>&#8221; Proceedings of IEEE International Symposium on Quality Electronic Design (ISQED), 2019.<\/li>\n\n\n\n<li><strong>[DAC&#8217;19]<\/strong>  T. Ajayi, V. A. Chhabria, M. Fogac\u00b8a, S. Hashemi, A. Hosny, A. B. Kahng, M. Kim, J. Lee, U. Mallappa, M. Neseem, G. Pradipta, S. Reda, M. Saligane, S. S. Sapatnekar, C. Sechen, M. Shalan,W. Swartz, L.Wang, Z.Wang, M. Woo, and B. Xu, &#8220;<a href=\"https:\/\/dl.acm.org\/doi\/10.1145\/3316781.3326334\">INVITED: Toward an Open-Source Digital Flow: First Learnings from the OpenROAD Project<\/a>,&#8221; Proceedings of ACM\/IEEE Design Automation Conference (DAC), 2019.<\/li>\n\n\n\n<li><strong>[GOMACTECH&#8217;19]<\/strong>  T. Ajayi, D. Blaauw, T.-B. Chan, C.-K. Cheng, V. A. Chhabria, D. K. Choo, M. Coltella, S. Dobre, R. Dreslinski, M. Fogac\u00b8a, S. Hashemi, A. Hosny, A. B. Kahng, M. Kim, J. Li, Z. Liang, U. Mallappa, P. Penzes, G. Pradipta, S. Reda, A. Rovinski, K. Samadi, S. S. Sapatnekar, L. Saul, C. Sechen, V. Srinivas, W. Swartz, D. Sylvester, D. Urquhart, L. Wang, M. Woo, and B. Xu, &#8220;OpenROAD: Toward a Self-Driving, Open-Source Digital Layout Implementation Tool Chain&#8221;, Proceedings of Government Microcircuit Applications and Critical Technology Conference (GOMACTECH), 2019.<\/li>\n<\/ol>\n\n\n\n<h3 class=\"wp-block-heading\">Archived<\/h3>\n\n\n\n<ol class=\"wp-block-list\">\n<li>M. A. A. Shohel, V. A. Chhabria, and S. S. Sapatnekar,&nbsp;<a href=\"https:\/\/arxiv.org\/abs\/2112.13451\">&#8220;A Linear-Time Algorithm for Steady-State Analysis of Electromigration in General Interconnects,<\/a>&#8221; arXiv:2112.13451 [cs.AR], 2022.<\/li>\n\n\n\n<li>V. A. Chhabria, Y. Zhang, H. Ren, B. Keller, B. Khailany and S. S. Sapatnekar,&nbsp;<a href=\"https:\/\/arxiv.org\/abs\/2012.10597\">&#8220;MAVIREC: ML-Aided Vectored IR-Drop Estimation and Classification,<\/a>&#8221; arXiv:2012.10597 [cs.AR], 2021.<\/li>\n<\/ol>\n\n\n\n<h3 class=\"wp-block-heading\">Patents<\/h3>\n\n\n\n<ol class=\"wp-block-list\">\n<li>V. A. Chhabria, B. A. Keller, Y. Zhang, B. Khailany, and H. Ren, \u201dReducing Crosstalk Pessimism using GPU-accelerated Gate Simulation and Machine Learning,\u201d US Patent App. 17\/540,167, 2023.<\/li>\n\n\n\n<li>V. A. Chhabria, Y. Zhang, H. Ren, and B. Khailany, \u201dDetermining IR Drop using ML,\u201d U.S. Patent App. 17\/211,695, 2022.<\/li>\n<\/ol>\n","protected":false},"excerpt":{"rendered":"<p class=\"mb-2\">Book chapters Journals Conferences Archived Patents<\/p>\n","protected":false},"author":202,"featured_media":0,"parent":0,"menu_order":7,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-111","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/faculty.engineering.asu.edu\/vidyachhabria\/wp-json\/wp\/v2\/pages\/111","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/faculty.engineering.asu.edu\/vidyachhabria\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/faculty.engineering.asu.edu\/vidyachhabria\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/faculty.engineering.asu.edu\/vidyachhabria\/wp-json\/wp\/v2\/users\/202"}],"replies":[{"embeddable":true,"href":"https:\/\/faculty.engineering.asu.edu\/vidyachhabria\/wp-json\/wp\/v2\/comments?post=111"}],"version-history":[{"count":0,"href":"https:\/\/faculty.engineering.asu.edu\/vidyachhabria\/wp-json\/wp\/v2\/pages\/111\/revisions"}],"wp:attachment":[{"href":"https:\/\/faculty.engineering.asu.edu\/vidyachhabria\/wp-json\/wp\/v2\/media?parent=111"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}