{"id":1203,"date":"2020-02-27T10:27:32","date_gmt":"2020-02-27T17:27:32","guid":{"rendered":"https:\/\/labs.engineering.asu.edu\/zhao\/?post_type=person&#038;p=1203"},"modified":"2020-02-27T10:27:34","modified_gmt":"2020-02-27T17:27:34","slug":"chen-yang","status":"publish","type":"person","link":"https:\/\/faculty.engineering.asu.edu\/zhao\/person\/chen-yang\/","title":{"rendered":"Chen Yang"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\"><strong>Chen Yang\u00a0<\/strong>received his\u00a0M.S.\u00a0degree in Material Physics &amp; Chemistry in 2018 and\u00a0B.S degree in Material Physics\u00a0in 2015\u00a0from Fudan University, China. His previous work focused on electronic materials and chip package reliability. He joined our research group in Aug 2018 and is currently pursuing a Ph.D degree in Electrical Engineering at ASU.<\/p>\n","protected":false},"featured_media":935,"menu_order":10,"template":"","meta":{"_acf_changed":false},"faculty-type":[6],"class_list":["post-1203","person","type-person","status-publish","has-post-thumbnail","hentry","faculty-type-ph-d-student"],"acf":[],"_links":{"self":[{"href":"https:\/\/faculty.engineering.asu.edu\/zhao\/wp-json\/wp\/v2\/person\/1203","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/faculty.engineering.asu.edu\/zhao\/wp-json\/wp\/v2\/person"}],"about":[{"href":"https:\/\/faculty.engineering.asu.edu\/zhao\/wp-json\/wp\/v2\/types\/person"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/faculty.engineering.asu.edu\/zhao\/wp-json\/wp\/v2\/media\/935"}],"wp:attachment":[{"href":"https:\/\/faculty.engineering.asu.edu\/zhao\/wp-json\/wp\/v2\/media?parent=1203"}],"wp:term":[{"taxonomy":"faculty-type","embeddable":true,"href":"https:\/\/faculty.engineering.asu.edu\/zhao\/wp-json\/wp\/v2\/faculty-type?post=1203"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}