Compact modeling of GaN HEMTs down to Cryogenic Temperature
Wide-bandgap III-Nitride devices excel in high-frequency and high-power applications due to their superior electron transport (high mobility, high saturation velocity) and high voltage tolerance. GaN HEMTs are especially promising for cryogenic systems—including space, superconducting electronics, and quantum computing—thanks to their polarization-induced 2DEG and enhanced low-temperature mobility. We develop a compact model capturing large- and small-signal GaN HEMT behavior across a wide temperature range, based on Landauer transport and two-dimensional electrostatics, ensuring accuracy and computational efficiency for SPICE-level circuit simulation. [Paper]