Research

Electrothermal Modeling and Design of β-Ga₂O₃ Transistors for RF Power Electronics

This project develops physics-based compact models for delta-doped β-Ga₂O₃ MOSFETs to advance next-generation RF power electronics. We combine electrostatics, carrier transport, and thermal modeling to capture quantum confinement, bias-dependent electron distribution, parasitic resistance, and self-heating—a key challenge arising from the material’s low thermal conductivity. Validated against experimental data and TCAD simulations, these models support circuit simulation and systematic exploration of device geometry and thermal management strategies. Our goal is to guide device optimization by evaluating trade-offs among gate scaling, electrical performance, and heat dissipation.

Design and Modeling of Ferroelectric III-Nitride Devices for Energy-Efficient Electronics

This project explores scandium aluminum nitride (ScAlN) ferroelectric heterostructures for next-generation energy-efficient transistors. We develop physics-based compact models that connect ferroelectric polarization dynamics with channel charge in ScAlN/AlN/GaN structures, capturing steady-state behavior and transient negative capacitance. Validated against numerical simulations and calibrated using experimental polarization data, these models enable circuit simulation in Verilog-A and Cadence Spectre. Our goal is to guide device design by understanding how ferroelectricity can enhance gate control and support low-power switching.

Compact modeling of GaN HEMTs down to Cryogenic Temperature

Wide-bandgap III-Nitride devices excel in high-frequency and high-power applications due to their superior electron transport (high mobility, high saturation velocity) and high voltage tolerance. GaN HEMTs are especially promising for cryogenic systems—including space, superconducting electronics, and quantum computing—thanks to their polarization-induced 2DEG and enhanced low-temperature mobility. We develop a compact model capturing large- and small-signal GaN HEMT behavior across a wide temperature range, based on Landauer transport and two-dimensional electrostatics, ensuring accuracy and computational efficiency for SPICE-level circuit simulation. [Paper]

TCAD Hydrodynamic Simulation of Wide Bandgap Material based Devices

TCAD hydrodynamic simulation captures critical non-equilibrium effects such as carrier heating and velocity overshoot, allowing accurate prediction of high-field and short-channel behavior. This capability provides deep insight into performance limitations and guides device optimization for enhanced speed, efficiency, and reliability.

At DEMO LAB, we leverage Synopsys Sentaurus and Silvaco ATLAS to simulate a wide range of device structures. By calibrating these simulations with experimental data, we gain a detailed understanding of device physics and explore design strategies for performance improvement.